In a broader sense, it also covers all electronic components such as resistors, capacitors, circuit boards/PCB boards, and many other related products.
IC industry development and reform Since the invention of integrated circuits (ICs) by Texas Instruments (TI) in 1958, with the development of silicon planar technology, bipolar and MOS types were invented in the 1960s. An important type of integrated circuit, which marks the quantum and qualitative leap in the era of electronic manufacturing of electronic tubes and transistors, has created an unprecedented new industry integrated circuit industry with strong penetration and exuberant vitality. Looking back at the development of integrated circuits, we can see that since the invention of integrated circuits more than 40 years ago, the phrase “from circuit integration to system integration†is for IC products from small-scale integrated circuits (SSI) to today's large-scale integrated circuits ( The best summary of the development process of ULSI is that the development of the entire integrated circuit product has gone through the traditional system-on-board to system-on-a-chip process. In this historical process, the world IC industry has undergone three changes in order to adapt to the development of technology and the needs of the market.
The first transformation: the primary stage of IC industry development dominated by processing and manufacturing.
In the 70's, the mainstream products of integrated circuits were microprocessors, memories, and standard general-purpose logic circuits. During this period, IC manufacturers (IDMs) played a major role in the IC market, and IC design only existed as a subsidiary. The IC design at this time is closely related to the semiconductor process. The IC design is mainly based on humans. The CAD system is only used for data processing and graphic programming. The IC industry is only in the primary stage of production-oriented.
Second Change: The Rise of Foundry and IC Design.
In the 1980s, the mainstream products of integrated circuits were microprocessors (MPUs), microcontrollers (MCUs), and application-specific ICs (ASICs). At this time, the combination of fabless and standard foundry has become a new model for the development of the integrated circuit industry.
With the widespread application and popularization of microprocessors and PCs (especially in areas such as communications, industrial control, and consumer electronics), the IC industry has entered a customer-oriented phase. On the one hand, ICs with standardized functions have been difficult to meet the requirements of the entire customer for system cost and reliability. At the same time, the customers of the complete machine are demanding to continuously increase the degree of IC integration, improve confidentiality, reduce the chip area, and reduce the size of the system and reduce costs. Improve the product's performance-to-price ratio, thereby enhancing the competitiveness of the product and gaining more market share and more profit; On the other hand, due to the advances in IC microfabrication technology, software hardware has become possible in order to improve the system. With the speed and simplification of the program, various hardware-structured ASICs such as gate arrays, programmable logic devices (including FPGAs), standard cells, and full-custom circuits emerged. The proportion of these ASICs accounted for 12% of the total IC sales in 1982. The third is that with the development of EDA tools (electronic design automation tools), PCB design methods are introduced into IC design, such as library concepts, process simulation parameters, and simulation concepts, etc. The design begins to enter the abstraction stage, making the design The process can exist independently of the production process. Visionary OEMs and entrepreneurs, including venture capital funds (VCs), have seen the market and development prospects of ASICs begin to establish professional design companies and IC design departments, a fabless integrated circuit design company (Fabless) or design. Departments have been established and rapidly developed. It also drove the rise of the standard process line (Foundry). The first Foundry factory in the world was the Taiwan Integrated Circuits Corporation established in 1987. Its founder Zhang Zhongmou was also hailed as "the father of wafer processing."
The third change: IC industry of “separation of four industries†In the 1990s, with the rise of INTERNET, the IC industry entered a competitive-oriented advanced stage, and international competition shifted from original resource competition and price competition to talent knowledge competition and intensive Capital competition. It has become a thing of the past to use DRAM as the center to expand the competition for equipment investment. For example, in 1990, the United States took Intel as its representative. In order to fight Japan’s threat of jumping to the top of the world's semiconductor market, it took the initiative to abandon the DRAM market, pursued a CPU, and made major structural adjustments to the semiconductor industry, regaining its position as the world’s semiconductor dominator. This has led people to realize that an increasingly large IC industry system is not conducive to the development of the entire IC industry. “Parting†can be refined, and “integration†can become an advantage. As a result, the transformation of the IC industry structure into a highly specialized one has become a trend. The situation has started to take shape in the design, manufacturing, packaging, and testing industries. In recent years, the development of the global IC industry has increasingly shown this structure. The advantages. For example, Taiwan’s IC industry is dominated by small and medium-sized enterprises, and it has formed a highly-divided industrial structure. Therefore, since 1996, affected by the Asian economic crisis, the global semiconductor industry has experienced an overproduction and efficiency decline, while the IC design industry has Get sustained growth.
In particular, the falling prices of DRAMs and the decline of MPUs that lasted for three years in 96, 97, 98, and the growth rate of the world's semiconductor industry have fallen far short of the previous value of 17%. If we rely on high input and upgrading technologies, we will pursue large-size silicon. The pursuit of microfabrication, the reduction of costs from large-scale production, and the promotion of its growth will be unsustainable. IC design companies are closer to the market and understand the market, and develop high value-added products through innovation, which directly promote the upgrading of electronic systems; at the same time, they profit from innovation and accumulate capital on the basis of rapid and coordinated development. The renewal of semiconductor equipment and new investment; IC design industry as the "leading" of the integrated circuit industry has injected new momentum and vitality for the growth of the entire integrated circuit industry.
Diamond Wire For Semiconductor Material Cutting
Diamond Wire for Semiconductor material cutting: diamond cutting wire is formed by uniformly consolidating diamond powder particles with a Mohs hardness of 10 on a high-strength steel wire substrate with a certain distribution density through a certain method. Originally used in sapphire cutting. Since 2010, diamond wire has been used in photovoltaic crystalline silicon wafer cutting, semiconductor material cutting, graphite cutting, jade cutting, magnetic material cutting, etc.
Diamond Wire For Semiconductor Material Cutting,Semiconductor Material Cutting,Semiconductor Material Cutting Wire,Diamond Wire For Semiconductor Material
Jiangyin Baoneng Precision New Material Co.,LTD , https://www.baonengwire.com